- Microstructure and Characteristics of Ag-SnO2 Contact Materials Prepared by Magnetic Pulsed Compaction
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J.S. Park, Y.J. Kim, M.H. Lee, H.S. Lee, S.J. Hong, J.K. Lee
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J Korean Powder Metall Inst. 2011;18(4):372-377.
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DOI: https://doi.org/10.4150/KPMI.2011.18.4.372
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 Abstract
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- In this study, we reported the microstructure and properties of Ag-SnO_2 contact materials fabricated by a controlled milling process with subsequent consolidation. The milled powders were consolidated to bulk samples using a magnetic pulsed compaction process. The nano-scale SnO_2 phases were distributed homogeneously in the Ag matrix after the consolidation. The relative density and hardness of the Ag-SnO_2 contact materials were 95~96% and 89~131 Hv, respectively.
- Synthesis of Ag-Cu Composite Powders for Electronic Materials by Electroless Plating Method
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C.H. Yoon, J.G. Ahn, D.J. Kim, J.S. Sohn, J.S. Park, Y.G. Ahn
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J Korean Powder Metall Inst. 2008;15(3):221-226.
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DOI: https://doi.org/10.4150/KPMI.2008.15.3.221
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Abstract
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- Silver coated copper composite powders were prepared by electroless plating method by controlling the activation and deposition process variables such as feeding rate of silver ions solution, concentration of reductant and molar ratio of activation solution (NH_4OH/(NH_4)_2SO_4) at room temperature. The characteristics of the product were verified by using a scanning electron microscopy (SEM), X-ray diffraction (XRD) and atomic absorption (A.A.). It is noted that completely cleansing the copper oxide layers and protecting the copper particles surface from hydrolysis were important to obtain high quality Ag-Cu composite powders. The optimum conditions of Ag-Cu composite powder synthesis were NH_4OH/(NH_4)_2SO_4 molar ratio 4, concentration of reductant 15g/l and feeding rate of silver ions solution 2 ml/min.
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